Liquid-assisted and thermoelectric-based temperature control for servers and other electronic equipment

Abstract

An apparatus in one embodiment comprises an electronic equipment chassis having electronic equipment installed therein, a thermoelectric module arranged adjacent a front portion of the electronic equipment chassis, a heat exchanger module arranged adjacent a rear portion of the electronic equipment chassis, and at least first and second liquid-carrying conduits coupled between the thermoelectric module and the heat exchanger module and passing through at least a portion of the electronic equipment chassis. The thermoelectric module, the heat exchanger module and the liquid-carrying conduits are collectively configured to provide temperature control for one or more components of the electronic equipment. The electronic equipment installed in the electronic equipment chassis may comprise at least one server. The thermoelectric module illustratively comprises a thermoelectric cooler, a cold plate coupled to a first side of the thermoelectric cooler, and a heatsink coupled to a second side of the thermoelectric cooler, opposite the first side.