The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Oct. 20, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Heasung Kim, Suwon-si, KR;

Sanghoon Kim, Suwon-si, KR;

Young Kuk Ko, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/181 (2026.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/4007 (2013.01); H05K 3/4644 (2013.01); H05K 2201/042 (2013.01);
Abstract

A disclosed circuit board includes: an insulating layer; a contact layer disposed on a first surface of the insulating layer; a connecting layer including a connecting portion embedded in the insulating layer and disposed on the contact layer; a via penetrating the insulating layer and connected to the connecting layer; and a wiring layer disposed on a second surface of the insulating layer opposing the first surface and connected to the via. The connecting portion includes a first connecting layer portion disposed on the contact layer and a second connecting layer portion disposed on the first connecting layer portion. The insulating layer includes a first portion embedding the first connecting layer portion and surrounding the first connecting layer portion and a second portion embedding the second connecting layer portion. The insulating layer includes a cavity penetrating the second portion. The first portion has a smaller area than the second portion.


Find Patent Forward Citations

Kim, Heasung. (2026). Circuit board, manufacturing method thereof, and electronic component package including the same (U.S. Patent No. 12764863). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12764863

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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