The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Oct. 28, 2024
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei Province, CN;
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Garuda Technology Co., Ltd., New Taipei City, TW;
Cheng-Jia Li, Shenzhen, CN;
HONGQISHENG PRECISION ELECTRONICS (QUINHUANGDAO) CO., LTD., Hebei Province, CN;
AVARY HOLDING (SHENZHEN) CO., LTD., Shenzhen, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei City, TW;
Abstract
A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure, and includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile