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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12764431 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Nov. 05, 2024

Hybrid image sensors with on-chip image deblur

Applicant:

Omnivision Technologies, Inc., Santa Clara, CA (US);

Inventors:

Tiejun Dai, Santa Clara, CA (US);

Bo Mu, San Jose, CA (US);

Menghan Guo, Shanghai, CN;

Wenlei Yang, Shanghai, CN;

Qinyi Wang, West Coast Vale, SG;

Luis Eduardo Garcia Capel, Jurong East, SG;

Rui Jiang, Singapore, SG;

Andreas Suess, San Jose, CA (US);

Assignee:

OMNIVISION TECHNOLOGIES, INC., Santa Clara, CA (US);

Attorney:

Dorsey & Whitney LLP

Primary Examiner:

Kelly L Jerabek

Int. Cl.
CPC ...
H04N 25/47 (2023.01); H04N 23/45 (2023.01); H04N 23/68 (2023.01); H04N 23/81 (2023.01); H04N 23/84 (2023.01); H04N 25/42 (2023.01); H04N 25/46 (2023.01); H04N 25/53 (2023.01); H04N 25/531 (2023.01); H04N 25/616 (2023.01); H04N 25/62 (2023.01); H04N 25/707 (2023.01); H04N 25/76 (2023.01); H04N 25/766 (2023.01); H04N 25/767 (2023.01); H04N 25/78 (2023.01); H04N 25/79 (2023.01);
U.S. Cl.
CPC ...
H04N 25/47 (2023.01); H04N 23/6811 (2023.01); H04N 23/683 (2023.01); H04N 23/81 (2023.01); H04N 23/843 (2023.01); H04N 25/42 (2023.01); H04N 25/46 (2023.01); H04N 25/53 (2023.01); H04N 25/616 (2023.01); H04N 25/62 (2023.01); H04N 25/707 (2023.01); H04N 25/76 (2023.01); H04N 25/766 (2023.01); H04N 25/767 (2023.01); H04N 25/78 (2023.01); H04N 25/79 (2023.01); H04N 23/45 (2023.01); H04N 25/531 (2023.01);
Abstract

Hybrid image sensors with on-chip image deblur (and associated systems, devices, and methods) are disclosed herein. In one embodiment, an image sensor includes (a) a plurality of CMOS image sensor (CIS) pixels configured to capture CIS data corresponding intensity of light incident on CIS pixels of the plurality of CIS pixels, (b) an event vision sensor (EVS) pixel configured to capture EVS data corresponding to events detected in light incident on the EVS pixel, and (c) a deblur circuit configured to generate deblurred image data based on the CIS data and an accumulation of events in the EVS data. The deblur circuit can be configured to compute the accumulation of events, such as using an event-based double integral model.

Find Patent Forward Citations

Dai, Tiejun. (2026). Hybrid image sensors with on-chip image deblur (U.S. Patent No. 12764431). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12764431

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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