The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Nov. 07, 2023
Applicant:

Dongguan Luxshare Technologies Co., Ltd, Dongguan City, CN;

Inventors:

Bin Huang, Dongguan City, CN;

Hongji Chen, Dongguan City, CN;

Kunlin Yao, Dongguan City, CN;

Chuanqi Gong, Dongguan City, CN;

Chenhui Zeng, Dongguan City, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6594 (2011.01); G02B 6/42 (2006.01); H01R 12/57 (2011.01); H01R 13/02 (2006.01); H01R 13/40 (2006.01); H01R 13/502 (2006.01); H01R 13/516 (2006.01); H01R 13/6587 (2011.01); H05K 7/20 (2006.01); H01R 12/58 (2011.01); H01R 12/71 (2011.01); H01R 13/405 (2006.01); H01R 13/648 (2006.01); H01R 13/658 (2011.01); H01R 13/6582 (2011.01); H01R 13/6583 (2011.01); H01R 13/6586 (2011.01); H01R 13/6591 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6594 (2013.01); G02B 6/4284 (2013.01); H01R 12/57 (2013.01); H01R 13/02 (2013.01); H01R 13/40 (2013.01); H01R 13/502 (2013.01); H01R 13/516 (2013.01); H01R 13/6587 (2013.01); H05K 7/2039 (2013.01); H05K 7/20409 (2013.01); H05K 7/20418 (2013.01); H01R 12/58 (2013.01); H01R 12/716 (2013.01); H01R 13/405 (2013.01); H01R 13/648 (2013.01); H01R 13/658 (2013.01); H01R 13/6582 (2013.01); H01R 13/6583 (2013.01); H01R 13/6586 (2013.01); H01R 13/6591 (2013.01); Y02T 10/70 (2013.01);
Abstract

A connector assembly includes an electrical connector, a metal shielding cage, and a heat dissipation element. The electrical connector includes an insulating body and a number of conductive terminals configured to be mounted on a circuit board. The metal shielding cage is shielded on a periphery of the electrical connector. The metal shielding cage includes a receiving chamber configured to receive a mating connector along a first direction. The first direction is perpendicular to the circuit board. The heat dissipation element includes a first heat sink. The first heat sinks include a number of first heat dissipation fins and a number of first heat dissipation channels.


Find Patent Forward Citations

Huang, Bin. (2026). Connector assembly with improved heat dissipation effect (U.S. Patent No. 12763525). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12763525

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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