The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Nov. 14, 2023
Applicant:

Amphenol Commercial Products (Chengdu) Co., Ltd., Chengdu, CN;

Inventors:

Kui Yang, Chengdu, CN;

Xiaodong Hu, Chengdu, CN;

Yaohua Hou, Chengdu, CN;

Lei Liao, Shenzhen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/6474 (2011.01); H01R 13/424 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6474 (2013.01); H01R 13/424 (2013.01);
Abstract

A connector for use with high-speed signals. The connector has a housing, which includes conductive elements held in a row by a housing. Each conductive element includes a thinner portion and a thicker portion. The conductive elements are configured to make contact with a mating component at the thicker portions. The thinner portions are closer to mating ends of respective conductive elements than respective thicker portions. The housing is configured to provide voids selectively disposed underneath the conductive elements. Such a configuration increases impedances for the conductive elements at locations that would otherwise have lower impedance and therefore reduces impedance variations along signal transmission paths. Such a configuration can also reduce stub size and therefore reduce insertion loss. Such a configuration meets signal integrity requirements in connectors designed for 64 Gbps and beyond, while conforming to a standard that constrains mating and mounting interfaces.


Find Patent Forward Citations

Yang, Kui. (2026). Kind of special structure gold finger pcie sas gen5 plug (U.S. Patent No. 12763522). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12763522

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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