The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Mar. 27, 2024
Applicant:

Contemporary Amperex Technology (Hong Kong) Limited, Hong Kong, CN;

Inventors:

Zhiyang Wu, Ningde, CN;

Chao Xie, Ningde, CN;

Yiruo Wang, Ningde, CN;

Gang Lin, Ningde, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/04 (2006.01); B32B 37/20 (2006.01); B32B 38/00 (2006.01); B32B 38/18 (2006.01); H01M 10/0587 (2010.01); H01M 50/46 (2021.01);
U.S. Cl.
CPC ...
H01M 10/0404 (2013.01); B32B 37/20 (2013.01); B32B 38/0004 (2013.01); B32B 38/1833 (2013.01); B32B 38/1875 (2013.01); H01M 10/0587 (2013.01); H01M 50/46 (2021.01); B32B 2309/72 (2013.01); B32B 2457/10 (2013.01);
Abstract

A manufacturing device for an electrode assembly comprises a first electrode plate feeding mechanism for conveying a first electrode plate, a first separator feeding mechanism for conveying a first separator, a second separator feeding mechanism for conveying a second separator, and a compounding mechanism provided downstream the first electrode plate feeding mechanism, the first separator feeding mechanism, and the second separator feeding mechanism. The compounding mechanism is used for sequentially laminating and compounding the first separator, the first electrode plate, and the second separator into a first electrode plate complex. The manufacturing device further comprises a second electrode plate feeding mechanism for conveying a second electrode plate having opposite polarity than the first electrode plate, and a winding mechanism provided downstream the compounding mechanism and the second electrode plate feeding mechanism and used for winding the first electrode plate complex and the second electrode plate to form an electrode assembly.


Find Patent Forward Citations

Wu, Zhiyang. (2026). Manufacturing device and manufacturing method for electrode assembly (U.S. Patent No. 12763353). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12763353

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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