The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Sep. 06, 2024
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Dae Jin Shim, Suwon-si, KR;

Jung Jin Park, Suwon-si, KR;

Hyo Sung Choi, Suwon-si, KR;

Ho Sam Choi, Suwon-si, KR;

Seung Yong Lee, Suwon-si, KR;

Yong Hwa Lee, Suwon-si, KR;

Hyo Sub Kim, Suwon-si, KR;

Jong Ho Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/12 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes; external electrodes disposed on the third and fourth surfaces; and side margin portions disposed on the fifth and sixth surfaces, and the cover portion and the side margin portion may include titanium (Ti) and gallium (Ga), and a ratio (B/A) of the number of moles (B) of gallium (Ga) compared to 100 moles of titanium (Ti) included in the side margin portion to the number of moles (A) of gallium (Ga) compared to 100 moles of titanium (Ti) included in the cover portion may satisfy 1.5≤B/A.


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Shim, Dae. (2026). Multilayer electronic component (U.S. Patent No. 12763256). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12763256

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