Ceramic electronic device provided with multilayer chip having internal electrode layers an external electrodes both containing sub metal element and manufacturing method of the same

Abstract

A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers of which a main component is a ceramic and each of a plurality of internal electrode layers including Ni as a main component are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, each of the plurality of internal electrode layers being exposed to two end faces opposite to each other; and external electrodes that are respectively provided on the two end faces and have a main component of Ni. The plurality of internal electrode layers include a sub metal element other than Ni, and co-materials. A concentration of the sub metal element in the plurality of internal electrode layers is higher than that in the external electrodes.