The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Feb. 21, 2025
Applicant:

Darfon Electronics Corp., Taoyuan City, TW;

Inventors:

Tsai-Jung Hu, Taoyuan City, TW;

Chun-Tan Wu, Taoyuan City, TW;

Tien-Szu Chen, Taoyuan City, TW;

Assignee:

DARFON ELECTRONICS CORP., Taoyuan City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
G06V 40/1318 (2022.01); H05K 1/147 (2013.01);
Abstract

A finger feature module includes a light guide seat including a frame and a plate body disposed in the frame and having an eccentrically disposed through hole, a circuit board assembly having a first portion disposed in the frame and located above the plate body and a second portion passing through the through hole to be at least partially located below the plate body, a feature sensor on the first portion of the circuit board assembly, and a plurality of illuminants electrically connected to the circuit board assembly, wherein two of the illuminants are located at two opposite ends of the through hole, and a virtual connecting line of the two illuminants overlaps the through hole.


Find Patent Forward Citations

Hu, Tsai-Jung. (2026). Finger feature module (U.S. Patent No. 12762888). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12762888

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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