The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Jun. 13, 2023
Kioxia Corporation, Tokyo, JP;
Tatsuro Hitomi, Hiratsuka Kanagawa, JP;
Yasuhito Yoshimizu, Kawasaki Kanagawa, JP;
Masayuki Miura, Tokyo, JP;
Arata Inoue, Chigasaki Kanagawa, JP;
Hiroyuki Dohmae, Yokohama Kanagawa, JP;
Koichi Nakazawa, Yokkaichi Mie, JP;
Mitoshi Miyaoka, Yokkaichi Mie, JP;
Kazuhito Hayasaka, Tokyo, JP;
Tomoya Sanuki, Yokkaichi Mie, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
According to one embodiment, a wafer includes a substrate including a first region and a second region that do not overlap each other; a first chip unit and a second chip unit each arranged on the substrate; a first electrode and a second electrode each electrically connected to the first chip unit; and a third electrode and a fourth electrode each electrically connected to the second chip unit. The first electrode and the third electrode are arranged in the first region. The second electrode and the fourth electrode are arranged in the second region. The first region is independent of a region in which the first chip unit and the second chip unit are provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile