The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Apr. 27, 2022
Polyplastics-evonik Corporation, Tokyo, JP;
Toray Industries, Inc., Tokyo, JP;
TORAY INDUSTRIES, INC., Tokyo, JP;
POLYPLASTICS-EVONIK CORPORATION, Tokyo, JP;
Abstract
The present disclosure relates to a resin composition for an adhesive layer. The resin composition contains: a polyphenylene sulfide-based resin (A); a polyamide resin (B); a first thermoplastic resin (C) containing at least one type of functional group selected from the group consisting of an epoxy group, an acid anhydride group, a carboxyl group, a carboxylic acid salt, and a carboxylic acid ester; and a second thermoplastic resin (D) that is free of epoxy groups, acid anhydride groups, carboxyl groups, carboxylic acid salts, and carboxylic acid esters. The resin composition contains, with respect to 100 parts by weight of the polyphenylene sulfide-based resin (A), from 80 to 300 parts by weight of the polyamide resin (B), from 20 to 200 parts by weight of the first thermoplastic resin (C), and from 10 to 100 parts by weight of the second thermoplastic resin (D), and a terminal amino group concentration of the polyamide resin (B) is from 48 to 120 mmol/kg.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile