The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Aug. 12, 2022
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Seonho Kong, Daejeon, KR;

Gun Ko, Daejeon, KR;

Sun Mo Son, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 67/02 (2006.01); C08J 3/20 (2006.01);
U.S. Cl.
CPC ...
C08L 67/02 (2013.01); C08J 3/203 (2013.01); C08J 2367/02 (2013.01); C08J 2425/12 (2013.01); C08J 2451/00 (2013.01); C08J 2467/02 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

Provided is a thermoplastic resin composition including 30 to 50 wt % of a polybutylene terephthalate resin (A); 8 to 20 wt % of a polyethylene terephthalate resin (B); 3 to 15 wt % of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C); 3 to 15 wt % of an aromatic vinyl compound-vinyl cyanide compound copolymer (D); 25 to 40 wt % of glass fiber (E); 0.15 to 1 wt % of a carbodiimide-based compound (F); 0.5 to 1.5 wt % of an epoxy compound (G); and 0.25 to 1.2 wt % of a hindered amine-based light stabilizer (H), a method of preparing the thermoplastic resin composition, and a molded article including the composition. The thermoplastic resin composition has excellent impact strength, tensile and flexural strength, and flexural modulus, and excellent heat resistance; has excellent flexural strength retention rate after the Air-HAST test; and satisfies product reliability required by automotive exterior materials and materials for electric/electronic parts.


Find Patent Forward Citations

Kong, Seonho. (2026). Thermoplastic resin composition, method of preparing the same, and molded article including the same (U.S. Patent No. 12760176). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12760176

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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