The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

Jul. 06, 2022
Applicant:

Daikin Industries, Ltd., Osaka, JP;

Inventors:

Yoshito Tanaka, Osaka, JP;

Makoto Matsuura, Osaka, JP;

Yuuki Suzuki, Osaka, JP;

Akitoshi Ogata, Osaka, JP;

Yosuke Kishikawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 4/00 (2006.01);
U.S. Cl.
CPC ...
C08G 4/00 (2013.01); C08G 2261/14 (2013.01); C08G 2261/62 (2013.01);
Abstract

An object of the present disclosure is to provide an encapsulation resin in which the occurrence of cracks is suppressed when the resin is used for encapsulation of ultraviolet light-emitting elements. Another object of the present disclosure is to provide an encapsulation resin composition for supplying the encapsulation resin. The present disclosure relates to an encapsulation resin for light-emitting elements, comprising a fluoropolymer, wherein the fluoropolymer comprises, as a main component, a monomer unit represented by formula (1): wherein Rto Rare each independently a fluorine atom, a fluoroalkyl group, or a fluoroalkoxy group.


Find Patent Forward Citations

Tanaka, Yoshito. (2026). Encapsulation resin (U.S. Patent No. 12760139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12760139

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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