The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2026

Filed:

May. 16, 2023
Applicants:

Acer Incorporated, New Taipei City, TW;

Nanpao New Materials Technology (Huaian) Co., Ltd., Jiangsu, CN;

Inventors:

Pin-Chueh Lin, New Taipei City, TW;

Wen-Chieh Tai, New Taipei City, TW;

Cheng-Nan Ling, New Taipei, TW;

Chang-Huang Huang, Jiangsu, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/16 (2006.01); B29C 45/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1679 (2013.01); B29C 45/0055 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stacked after the painting layer washes and squeezes at least a portion of the flowing painting layer to form a random texture pattern.


Find Patent Forward Citations

Lin, Pin-Chueh. (2026). Manufacturing method of housing structure of electronic device (U.S. Patent No. 12759204). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12759204

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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