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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12758933 B1

PDFFull Text
Date of Patent:
Oct. 13, 2026

Filed:

Oct. 14, 2022

Pressure sensor module and dispensing device including pressure sensor module

Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Masatoshi Kanamaru, Tokyo, JP;

Tatsuya Yamasaki, Tokyo, JP;

Yoichiro Suzuki, Tokyo, JP;

Takuya Takahashi, Tokyo, JP;

Takanori Aono, Tokyo, JP;

Assignee:

HITACHI HIGH-TECH CORPORATION, Tokyo, JP;

Attorney:

MATTINGLY & MALUR, PC

Primary Examiner:

Tarun Sinha

Int. Cl.
CPC ...
B01J 4/00 (2006.01); G01L 9/00 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
B01J 4/008 (2013.01); G01L 9/0054 (2013.01); G01L 19/0023 (2013.01);
Abstract

A pressure sensor module according to the invention includes, inside a flow channel substrate, a flow channel configured to allow system water to flow therethrough and a branch channel connected to the flow channel, in which a semiconductor element on which a strain detection unit is mounted is joined to the flow channel substrate via a joining layer at an outlet portion of the branch channel so as to close the outlet portion of the branch channel. A moisture prevention film is provided so as to cover a surface of the flow channel substrate in the branch channel, a surface of the joining layer in the branch channel, and a surface of the semiconductor element on a side where the strain detection unit is not mounted.

Find Patent Forward Citations

Kanamaru, Masatoshi. (2026). Pressure sensor module and dispensing device including pressure sensor module (U.S. Patent No. 12758933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12758933

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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