The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Nov. 01, 2023
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Aurora Sanna, Milan, IT;

Cristina Somma, Cinisello Balsamo, IT;

Damian Halicki, Agrate Brianza, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 20/20 (2026.01); H10W 20/41 (2026.01); H10W 70/65 (2026.01);
U.S. Cl.
CPC ...
H10W 90/701 (2026.01); H10W 20/20 (2026.01); H10W 20/427 (2026.01); H10W 70/65 (2026.01);
Abstract

A BGA package includes an array of electrically conductive balls providing electrical contact for a semiconductor die. A power channel is provided to convey power supply current towards the semiconductor die. The power channel is formed by a stack of electrically conductive planes. The electrically conductive planes are stacked in a stepped arrangement wherein a number of stacked planes in each step of the stack increases in a direction from a distal end to a proximal end of the power channel. Adjacent electrically conductive planes in the stack of the power channel are electrically coupled with electrically conductive vias extending therebetween. Current conduction paths towards the die area thus have resistance values that decrease from the distal end to the proximal end of the power channel.


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