The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Aug. 29, 2023
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Satoru Itakura, Tokyo, JP;
Masayuki Miura, Tokyo, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10P 76/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 74/47 (2026.01); H10W 90/20 (2026.01); H10W 90/24 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10P 76/2041 (2026.01); H10W 74/01 (2026.01); H10W 74/47 (2026.01); H10W 90/291 (2026.01); H10W 74/117 (2026.01); H10W 90/24 (2026.01); H10W 90/752 (2026.01); H10W 90/754 (2026.01);
Abstract
According to one embodiment, a method of manufacturing a semiconductor device includes placing a first semiconductor element on a wiring board, forming a first mask having an opening on the wiring board so that the first semiconductor element is positioned in the opening, putting a liquid first resin precursor into the opening of the first mask, curing the first resin precursor to obtain a first resin layer, and then removing the first mask.
Itakura, Satoru. (2026). Encapsulating semiconductor chips using masks (U.S. Patent No. 12757793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757793
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile