The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jul. 24, 2023
Applicant:

Xiamen San'an Optoelectronics Co., Ltd., Xiamen, CN;

Inventors:

Tung-Kai Liu, Xiamen, CN;

Shao-Ying Ting, Xiamen, CN;

Chen-Ke Hsu, Xiamen, CN;

Chia-En Lee, Xiamen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10P 72/74 (2026.01); H10P 72/7432 (2026.01);
Abstract

A light-emitting assembly with a raised adhesive layer includes a substrate, an adhesive layer, a plurality of light emitting units, and a protective layer. The adhesive layer is disposed on the substrate in a first direction. The light emitting units are disposed on the adhesive layer opposite to the substrate in the first direction. Each of the light emitting units includes a first-type semiconductor layer, a second-type semiconductor layer, an active layer that is disposed between the first-type and second-type semiconductor layers, a first electrode that is electrically connected to the first-type semiconductor layer, and a second electrode that is electrically connected to the second-type semiconductor layer. The protective layer is connected between the adhesive layer and the light emitting units, and has a Shore A hardness greater than that of said adhesive layer. A light emitting apparatus is also provided herein.


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