The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Sep. 30, 2022
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Han Sang Kim, Seoul, KR;

Bo Ra Kang, Seoul, KR;

Jeong Han Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/69 (2026.01); H10W 70/63 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/69 (2026.01); H10W 70/635 (2026.01); H10W 90/724 (2026.01);
Abstract

A circuit board according to an embodiment includes an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the insulating layer includes a surface layer containing fluorine (F), and the circuit pattern layer is disposed on the surface layer of the insulating layer.


Find Patent Forward Citations

Kim, Han. (2026). Circuit board and semiconductor package comprising same (U.S. Patent No. 12757775). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757775

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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