The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Aug. 30, 2023
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/69 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 70/69 (2026.01); H10W 72/884 (2026.01); H10W 90/736 (2026.01); H10W 90/756 (2026.01);
Abstract
A semiconductor device includes a semiconductor substrate, a first electroconductive member that is formed on the semiconductor substrate and that has a first linear portion extending along a principal surface of the semiconductor substrate, and an organic insulation layer that is formed on the semiconductor substrate and that covers the first electroconductive member, and the first linear portion includes a first side edge portion formed by a curve that is alternately bent to one side and to an opposite side of a direction intersecting a longitudinal direction of the first linear portion in a plan view.