The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Mar. 02, 2023
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Keiichi Niwa, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H10B 80/00 (2023.01); H10W 70/05 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/30 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10B 80/00 (2023.02); H10W 70/05 (2026.01); H10W 70/685 (2026.01); H10W 72/072 (2026.01); H10W 72/07236 (2026.01); H10W 72/07354 (2026.01); H10W 72/222 (2026.01); H10W 72/252 (2026.01); H10W 72/347 (2026.01); H10W 72/865 (2026.01); H10W 72/877 (2026.01); H10W 72/884 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/732 (2026.01); H10W 90/734 (2026.01); H10W 90/752 (2026.01); H10W 90/754 (2026.01);
Abstract

According to one embodiment, a wiring board, includes a conductive layer on a first surface and an insulating layer covering a portion of the conductive layer. The conductive layer includes a first connection portion exposed from the insulating layer and having a first wettability to solder, a lead-out portion connected to the first connection portion and exposed from the insulating layer and having a second wettability to solder, and a wiring portion connected to the first connection portion via the lead-out portion and covered with the insulating layer. In some examples, the first connection portion may be coated with a gold layer and the conductive layer may be copper or a copper alloy material.


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