The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Feb. 25, 2022
Pierburg Gmbh, Neuss, DE;
Mika Nuotio, San Jose, CA (US);
Dieter Jelinek, Kaarst, DE;
Oguz Demir, Heilbronn, DE;
Patrick Bauer, Hassmersheim, DE;
PIERBURG GMBH, Neuss, DE;
Abstract
A power semiconductor package includes a first substrate assembly with power semiconductor dies, a second substrate assembly arranged parallel to the first substrate assembly, and source contacts. The second substrate assembly has a copper cladding layer which defines a source copper cladding layer circuit having a bonding area which, when mechanically contacted, provides an electrical connection to the source copper cladding layer circuit. Each of the source contacts provide an electrical connection between a source connection of one of the power semiconductor dies and the source copper cladding layer circuit. The source contacts are arranged at different distances from the bonding area of the source copper cladding layer circuit. The source copper cladding layer circuit also has an electrically isolating slot arranged between one of the source contacts which is closest to the bonding area of the source copper cladding layer circuit and the bonding area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile