The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
May. 06, 2022
Texas Instruments Incorporated, Dallas, TX (US);
Wei Fen Sueann Lim, Melaka, MY;
Jeevintharan A/L Sivasankaran, Negeri Sembilan, MY;
Khair Khaizal, Seremban, MY;
Edwin Jin Keong Lim, Kuala Lumpur, MY;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
An electronic device includes a molded package structure and a conductive lead partially exposed outside the package structure, the package structure having lateral sides extending at an angle that is greater than 15 degrees and 25 degrees or less to facilitate mold cavity filling during package molding and mitigate mold voids in the electronic device. A method of fabricating an electronic device includes attaching a die to a lead frame, electrically coupling a conductive terminal of the die to a conductive lead and performing a molding process using a mold having cavity sidewalls with a draft angle greater than 15 degrees and 25 degrees or less to form a package structure that encloses the die and partially encloses the conductive lead.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile