The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Oct. 11, 2023
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Gabriel Loh, Bellevue, WA (US);
Divya Madapusi Srinivas Prasad, Mountain View, CA (US);
Girish Anant Kini, Santa Clara, CA (US);
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Abstract
An integrated circuit die stack is disclosed that includes a digital device layer, an underlying layer, and a cooling solution. The underlying layer has a lower power consumption relative to the digital device layer. The digital device layer is disposed closer to the cooling solution. In another example, memory layers and a digital device layer are configured into a three-dimensional memory stack. The digital device layer has a first surface (side) located closest to a cooling solution and the memory layers are located on a second surface (side) of the digital device layer opposite to the first surface (side) thereof. The cooling solution is adapted to receive and dissipate heat from the digital device layer and the memory layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile