The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Aug. 19, 2021
Applicant:
Siemens Aktiengesellschaft, Munich, DE;
Inventors:
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/43 (2026.01); H10W 40/22 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/228 (2026.01); H10W 40/43 (2026.01); H10W 90/00 (2026.01);
Abstract
An arrangement for cooling semiconductor components includes a cooling body base with a component side and a structural element side opposite the component side, wherein the semiconductor components are arrangeable in succession in the flow direction of a cooling medium, the structural element side are configured to increase its surface area by structural elements, and the structural element side is configured such that a density of structural elements involved in the cooling increases in the flow direction with regard to cooling zones.