The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 02, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Nicholas Anthony Lanzillo, Wynantskill, NY (US);
Reinaldo Vega, Mahopac, NY (US);
Takashi Ando, Eastchester, NY (US);
David Wolpert, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/00 (2026.01); H10W 20/41 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/089 (2026.01); H10W 20/057 (2026.01); H10W 20/082 (2026.01); H10W 20/42 (2026.01); H10W 20/425 (2026.01); H10W 20/435 (2026.01);
Abstract
A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a skip via. The skip via includes a first skip via segment vertically connected to a second skip via segment. The first skip via segment has a first width and the second skip via segment has a second width.