The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Apr. 03, 2024
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Osamu Zaima, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); H10P 72/0428 (2026.01); H10P 72/0442 (2026.01); H10P 72/7416 (2026.01);
Abstract
An object is to provide a technique capable of suppressing unevenness of force applied to a dicing blade in cutting an orientation flat. A semiconductor manufacturing device includes a stage and a transport machine. A semiconductor wafer including an orientation flat and a jig having a shape corresponding to the orientation flat to be used for cutting the orientation flat by a dicing blade are fixed to each other by a dicing tape on the stage. The transport machine transports the jig so that the jig faces the orientation flat on the stage.