The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Mar. 17, 2023
Applicant:

Soulbrain Co., Ltd., Gyeonggi-do, KR;

Inventors:

Seung Hyun Lee, Gyeonggi-do, KR;

Jae Sun Jung, Gyeonggi-do, KR;

Chang Bong Yeon, Gyeonggi-do, KR;

Deok Hyun Kim, Gyeonggi-do, KR;

Assignee:

SOULBRAIN CO., LTD., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 14/60 (2026.01);
U.S. Cl.
CPC ...
H10P 14/6512 (2026.01); H10P 14/6339 (2026.01);
Abstract

Disclosed is a method of forming a thin film, a semiconductor substrate fabricated using the method, and a semiconductor device including the semiconductor substrate. By effectively replacing the ligand of an adsorption precursor by using a reaction surface pretreatment agent and a ligand substitution agent in combination, the reaction speed may be improved and the thin film growth rate may be appropriately reduced. In addition, even when forming a thin film on a substrate with a complex structure, step coverage and the thickness uniformity of a thin film may be greatly improved, impurities may be reduced, and film quality may be improved.


Find Patent Forward Citations

Lee, Seung. (2026). Method of forming thin film (U.S. Patent No. 12757655). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757655

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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