The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jul. 31, 2023
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Baolei Huo, Beijing, CN;

Yang Wang, Beijing, CN;

Qiang Zhou, Beijing, CN;

Feifei Gao, Beijing, CN;

Hanxiao Zhang, Beijing, CN;

Yonghua Li, Beijing, CN;

Guoqiang Tang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/122 (2023.01); H10K 59/12 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
H10K 59/122 (2023.02); H10K 59/1201 (2023.02); H10K 59/80521 (2023.02);
Abstract

Provided is a display panel. The display panel includes a substrate, a display structure and a package structure, wherein the display structure is disposed on the substrate, the package structure is packaged on a side, away from the substrate, of the display structure, the display structure includes a pixel definition layer, a light-emitting layer and a patterned cathode layer, the pixel definition layer is disposed on the substrate, a light-emitting region opening is disposed on the pixel definition layer, a portion of the light-emitting layer is disposed in the light-emitting region opening, the patterned cathode layer is disposed on the pixel definition layer and the light-emitting layer, the patterned cathode layer has a cathode patterned notch; and the package structure includes a first package layer packaged on the display structure, and thickness uniformity of the first package layer is greater than or equal to 60%.


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