The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Nov. 09, 2022
Hefei Boe Ruisheng Technology Co., Ltd., Hefei, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Chunjian Liu, Beijing, CN;
Jian Tian, Beijing, CN;
Jianying Zhang, Beijing, CN;
Jie Lei, Beijing, CN;
Yajun MA, Beijing, CN;
Jiawei Xu, Beijing, CN;
Hefei BOE Ruisheng Technology Co., Ltd., Hefei, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A wiring substrate includes a plurality of functional units arranged in an array. Each of the functional units includes: a plurality of first pad groups arranged along a first direction, and a second pad group located at a side of the plurality of the first pad groups along the second direction. The second pad group includes a plurality of channel pads and at least two functional pads, and a number of pads in the second pad group is even and the pads in the second pad group are arranged at intervals in a 2*N array. The plurality of channel pads are arranged at intervals along a same direction in a first line and are respectively connected one-to-one with a plurality of first pad groups of which a number is same as a number of the plurality of the channel pads.