The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jan. 19, 2024
Applicant:

Oki Electric Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroto Kawada, Tokyo, JP;

Takuma Ishikawa, Tokyo, JP;

Hironori Furuta, Tokyo, JP;

Takahito Suzuki, Tokyo, JP;

Kenichi Tanigawa, Tokyo, JP;

Yusuke Nakai, Tokyo, JP;

Yutaka Kitajima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/82 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/82 (2025.01); H10H 20/01 (2025.01);
Abstract

A manufacturing method of an electronic structure includes forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer. The manufacturing method further includes forming a cover layer extending from the substrate to the second sacrificial layer, and removing the first sacrificial layer and the second sacrificial layer.


Find Patent Forward Citations

Kawada, Hiroto. (2026). Electronic structure, manufacturing method of electronic structure, and manufacturing method of electronic device (U.S. Patent No. 12757527). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757527

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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