The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jun. 07, 2024
Applicant:

Dell Products Lp, Round Rock, TX (US);

Inventors:

Yu-Ming Kuo, New Taipei City, TW;

Kang-Wei Fan, ZhongLi Dist, TW;

Tung-Yi Chen, Banciao, TW;

Jing-Tang Wu, Xizhi District, TW;

Shu-Yu Jiang, Shilin Dist., TW;

Chun-Hsiung Wang, Taoyuan City, TW;

Assignee:

DELL PRODUCTS LP, Round Rock, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); G06F 1/20 (2013.01);
Abstract

A heatsink expansion card holder module for operative coupling to a motherboard of an information handling system comprising a plastic card holder frame including a frame structure including a plurality of double snap fit hooks extending from a perimeter of the frame structure. A metal heatsink card to snap in to a first layer of the plurality of double snap fit hooks such that the metal heatsink card is held to the plastic card holder frame. The heatsink expansion card holder module sized to fit a first type of expansion card by snapping into a second layer of at least two of the plurality of the double snap fit hooks or to fit a second type of expansion card by snapping into the second layer of the plurality of the double snap fit hooks using greater number of the plurality of the double snap fit hooks.


Find Patent Forward Citations

Loading…