The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Apr. 16, 2024
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Teruhiro Nakamiya, Setagaya, JP;

Nobuyuki Okunaga, Odawara, JP;

Haruki Nitta, Fujisawa, JP;

Junichiroh Hatazawa, Atsuga, JP;

Tatsuo Hayakawa, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/189 (2026.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/111 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A hard disk drive flexible printed circuit (FPC) includes fingers extending from a main portion from a root to a tip, with each finger including a first conductive trace layer positioned on a first side of a base layer and including a particular plurality of electrical pads extending to an edge, and a second conductive trace layer positioned on an opposing second side of the base layer. Particular traces of the second conductive trace layer electrically connected to the pads are configured to inhibit bubbling of an adhesive layer in response to heating of the pads. This may involve routing so as not to overlap with the pads to inhibit heat transfer from the pads to the second conductive trace layer during soldering, and/or configuring such that the adhesive layer between the particular traces is wider than each particular trace to maximize exposure of evaporative surface area of adhesive layer.


Find Patent Forward Citations

Nakamiya, Teruhiro. (2026). Flexible printed circuit to suspension soldering improvement (U.S. Patent No. 12757332). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757332

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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