The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

May. 24, 2024
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventor:

Seung Min Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 2201/10242 (2013.01);
Abstract

A printed circuit board including: an insulating layer; a wiring layer disposed on an outermost side of the insulating layer and including a first pad and a first pattern; a first post disposed on the first pattern; and a resist layer disposed on the insulating layer and covering the wiring layer and the first post, wherein the resist layer may have a first protrusion in a region covering the first post and may have a first opening exposing the first pad from the resist layer.


Find Patent Forward Citations

Lee, Seung. (2026). Printed circuit board (U.S. Patent No. 12757326). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12757326

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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