The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Sep. 01, 2022
Applicant:
Skyworks Solutions, Inc., Irvine, CA (US);
Inventors:
Assignee:
Skyworks Solutions, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/64 (2006.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); H03H 9/02818 (2013.01); H03H 9/02834 (2013.01); H03H 9/6483 (2013.01);
Abstract
A surface acoustic wave package has a piezoelectric layer over a substrate and a thermally conductive structure attached to the substrate. The outer boundary of the piezoelectric layer is removed (e.g., etched) so that a resulting outer edge of the piezoelectric layer is spaced inward of an inner edge of the thermally conductive structure. The piezoelectric layer does not contact the thermally conductive structure to inhibit damage to the piezoelectric layer due to a stress differential between the substrate and the thermally conductive structure during a packaging process.