The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jan. 18, 2024
Applicant:

Flowserve Pte. Ltd., Singapore, SG;

Inventors:

Zachary Dennis, Emmaus, PA (US);

Neil Havrilla, Coplay, PA (US);

Sean A. Cain, Tulsa, OK (US);

Assignee:

Flowserve Pte. Ltd., Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 3/52 (2006.01); H02K 15/095 (2006.01); H02K 21/24 (2006.01);
U.S. Cl.
CPC ...
H02K 3/522 (2013.01); H02K 15/095 (2013.01); H02K 21/24 (2013.01); H02K 2203/06 (2013.01); H02K 2203/12 (2013.01);
Abstract

A coil assembly of a seal-less pump or turbine comprises materials having differing coefficients of thermal expansion that are layered but not bonded together, thereby reducing thermal stresses at cryogenic temperatures. Differences in shrinkage upon cooling provides compressive structural support. Coils are wound on hollow, non-magnetic spools, and a resin is applied for mechanical support, for example by vacuum impregnation. A release agent prevents bonding of the resin to the coils. The hollow spools are then placed over winding cores, such as laminated iron cores, without bonding. During cooling, the non-metallic spools shrink more than the cores, thereby providing compression fits. At ambient temperature, the spools can be held in place by interferences fits, and/or by key-stock pieces. Wired interconnections between the coils can be located within a wire harness cavity, which can be filled with a resin to provide mechanical support, while a release agent prevents bonding.


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