The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Nov. 08, 2024
Socionext Inc., Kanagawa, JP;
Isaya Sobue, Yokohama, JP;
SOCIONEXT INC., Kanagawa, JP;
Abstract
A semiconductor device includes: a substrate; first, second, and third substrate power-supply interconnects in the substrate; first and second substrate clamp circuits in the substrate, between the first and second substrate power-supply interconnects, and between the first and third substrate power-supply interconnects, respectively; first and second semiconductor chips on the substrate; first and second chip power-supply interconnects in the first semiconductor chip, electrically-connected to the first substrate power-supply interconnect and to the second substrate power-supply interconnect, respectively; a first circuit in the first semiconductor chip, between the first and second chip power-supply interconnects; third and fourth chip power-supply interconnects in the second semiconductor chip, electrically-connected to the first substrate power-supply interconnect and to the third substrate power-supply interconnect, respectively; and a second circuit in the second semiconductor chip, between the third and fourth chip power-supply interconnects, and a signal from the first circuit is input to the second circuit.