The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Sep. 21, 2023
Applicant:

Amphenol Corporation, Wallingford, CT (US);

Inventors:

Mark R. Gray, York, PA (US);

Benjamin Reed Staudt, Harrisburg, PA (US);

Assignee:

Amphenol Corporation, Wallingford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/50 (2006.01); H01R 12/71 (2011.01); H01R 12/73 (2011.01); H01R 13/6477 (2011.01); H01R 13/502 (2006.01); H01R 13/504 (2006.01); H01R 13/6473 (2011.01); H01R 13/6474 (2011.01); H01R 13/6585 (2011.01);
U.S. Cl.
CPC ...
H01R 13/50 (2013.01); H01R 12/716 (2013.01); H01R 12/73 (2013.01); H01R 13/6477 (2013.01); H01R 12/71 (2013.01); H01R 12/712 (2013.01); H01R 12/714 (2013.01); H01R 13/502 (2013.01); H01R 13/504 (2013.01); H01R 13/6473 (2013.01); H01R 13/6474 (2013.01); H01R 13/6585 (2013.01);
Abstract

A low-profile mezzanine connector. The connector is simple to manufacture and can be reliably formed even with a stack height of 4 mm or less yet has high signal integrity. The connector has a field of identically shaped contacts that are functionally differentiated through features of the housing, including lossy material in patches with narrower projections electrically coupled to contacts designated as ground contacts. The mating portions of the contacts are adjacent a wall of the housing, which is tapered to increase the effective dielectric constant in the vicinity of the signal contacts. Each contact may have a hole in it to engage an insertion tool to enable repeatable and stable insertion of the contacts into a housing. The footprint for mounting the connector to a PCB may include signal vias offset from the mounting pads for signal contacts.


Find Patent Forward Citations

Gray, Mark. (2026). High performance mezzanine connector with low stack height (U.S. Patent No. 12756130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12756130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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