The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jun. 14, 2024
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventor:
Arvinder Manmohan Singh Chadha, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H10P 72/72 (2026.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32477 (2013.01); H10P 72/722 (2026.01); H01J 2237/002 (2013.01); H01J 2237/0206 (2013.01); H01J 2237/2005 (2013.01); H01J 2237/2007 (2013.01);
Abstract
A substrate support assembly includes a cooling plate. The substrate support assembly further includes a chuck disposed on the cooling plate. The chuck includes one or more clamp electrodes to electrostatically secure the chuck to the cooling plate. The substrate support assembly further includes multiple mesas formed on a bottom surface of the chuck or formed on a top surface of the cooling plate to separate the chuck from the cooling plate.
Chadha, Arvinder Manmohan Singh. (2026). Electrostatically secured substrate support assembly (U.S. Patent No. 12755944). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12755944
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile