The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Jun. 30, 2023
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Ryuichiro Tominaga, Nagaokakyo, JP;
Keisuke Kunimori, Nagaokakyo, JP;
Yuuki Kawakami, Nagaokakyo, JP;
Yoshimasa Yoshioka, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
An electronic component capable of improving connection reliability between a via conductor and a circuit pattern. An electronic component includes a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor provided inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor. The via conductor and the wiring member are integrally formed, and in the via conductor, a diameter of an end portion on a side close to the circuit pattern is larger than a diameter of an end portion on a side close to the wiring member.