The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Mar. 30, 2022
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Noriyuki Saito, Tokyo, JP;

Yoshinori Sato, Tokyo, JP;

Toru Yoshida, Tokyo, JP;

Akira Suda, Tokyo, JP;

Akira Nakamura, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 17/0013 (2013.01);
Abstract

A laminated electronic component includes an element body formed by laminating an insulating layer and having a bottom surface used as a mounting surface, and side surfaces configured to extend to intersect the bottom surface, and a bottom surface electrode formed on the bottom surface of the element body, wherein the bottom surface electrode includes a first electrode layer and a second electrode layer formed on the element body side from the first electrode layer, the first electrode layer is a resin electrode laminated to cover the second electrode layer, and has a stretched portion configured to extend to the side surface, and a width dimension of the stretched portion is smaller than a width dimension of the first electrode layer on the bottom surface.


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