The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Dec. 17, 2021
Applicants:

Dow Global Technologies Llc, Midland, MI (US);

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Yabin Sun, Shanghai, CN;

Gaoxiang Wu, Lake Jackson, TX (US);

Colin Lipishan, Lake Jackson, TX (US);

Timothy J. Person, Collegeville, PA (US);

Wenxin Zhang, Shanghai, CN;

Kainan Zhang, Shanghai, CN;

Jie Ji, Shanghai, CN;

Assignees:

Dow Global Technologies LLC, Midland, MI (US);

Dow Silicones Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 19/00 (2006.01); C08J 3/24 (2006.01); C08K 5/06 (2006.01); C08K 5/54 (2006.01); H01B 3/44 (2006.01); H01B 17/60 (2006.01); C08K 5/14 (2006.01); C08L 23/06 (2006.01); H01B 13/06 (2006.01);
U.S. Cl.
CPC ...
H01B 19/00 (2013.01); C08J 3/24 (2013.01); C08K 5/06 (2013.01); C08K 5/54 (2013.01); H01B 3/441 (2013.01); H01B 17/60 (2013.01); C08J 2323/04 (2013.01); C08K 5/14 (2013.01); C08K 2201/012 (2013.01); C08L 23/06 (2013.01); C08L 2203/202 (2013.01); H01B 13/06 (2013.01);
Abstract

The present disclosure provides a process. In an embodiment, the process includes providing an initial cable core. The initial cable core includes (i) a conductor and (ii) an initial insulation layer. The initial insulation layer includes a crosslinkable polymeric composition composed of (a) an ethylene-based polymer composed of (1) ethylene monomer, (2) an optional α-olefin comonomer, and (3) an optional organosiloxane comonomer. The crosslinkable polymeric composition further includes (b) dicumyl peroxide (DCP), (c) an Si—H containing (AP) scavenger, (d) optional curing coagent, and (e) optional anti-oxidant. The process includes subjecting the initial cable core to a crosslinking procedure sufficient to crosslink the crosslinkable polymeric composition and form a cable core with a crosslinked insulation layer.


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