The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
May. 24, 2023
Applicant:
Swcc Corporation, Kawasaki, JP;
Inventors:
Assignee:
SWCC Corporation, Kawasaki, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); B21C 1/02 (2006.01); B21F 15/04 (2006.01); C22F 1/08 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/026 (2013.01); B21C 1/02 (2013.01); B21F 15/04 (2013.01); C22F 1/08 (2013.01); H01B 13/0016 (2013.01);
Abstract
An object of the present invention is to provide a Cu—Ag alloy wire that has satisfactory hardness and specific resistance both suitable for probe pins. A Cu—Ag alloy wire that achieves the above object contains 0.1 to 30 mass % of Ag, with a remainder composed of Cu and unavoidable impurities. The Cu—Ag alloy wire has a Vickers hardness of 300 HV or more and a specific resistance of 3.0μΩ·cm or less.
Odachi, Go. (2026). Cu—ag alloy wire and method for producing the same (U.S. Patent No. 12755860). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12755860
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile