The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jun. 01, 2023
Applicant:

Kona M Co., Ltd., Chungcheongbuk-do, KR;

Inventors:

Young Hoon Jeong, Seosan-si, KR;

Jae Min Yang, Jincheon-gun, KR;

Ki Sung Nam, Jincheon-gun, KR;

Assignee:

KONA M CO., LTD., Chungcheongbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07722 (2013.01); G06K 19/0775 (2013.01);
Abstract

A wireless IC metal card according to an embodiment of the present disclosure may include a first metal layer that receives a wireless IC chip on a top surface thereof; an antenna layer disposed in a partial region of a bottom surface of the first metal layer and electrically connected to the wireless IC chip; a second metal layer disposed below the first metal layer, with the antenna layer interposed therebetween; and a third metal layer disposed below the second metal layer, wherein the first metal layer, the second metal layer, and the third metal layer are bonded to one another to form a clad metal structure.


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Jeong, Young. (2026). Wireless ic metal card with clad metal structure formed thereon and method of manufacturing same (U.S. Patent No. 12755126). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12755126

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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