The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Dec. 13, 2024
Microchip Technology Incorporated, Chandler, AZ (US);
Ali Darvishian, Lynn, MA (US);
Peter Cash, Lynnfield, MA (US);
Microchip Technology Incorporated, Chandler, AZ (US);
Abstract
A physics package for chip scale atomic clocks is provided. The physics package may include a first Low-Temperature Co-fired Ceramic (LCC) pad, a first suspension coupled to the first LCC pad, a core coupled to the first suspension, a second suspension coupled to the core and coupled to the first suspension to encapsulate the core, and a second LCC pad coupled to the second suspension and coupled to the first LCC pad to encapsulate the first suspension, the core, and the second suspension. The core may be manufactured using a wafer level fabrication process.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile