The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jul. 25, 2025
Applicant:

Quadratic 3d, Inc., Charlestown, MA (US);

Inventors:

Samuel N. Sanders, Arlington, MA (US);

Emily M. Arndt, Arkon, OH (US);

Elango Kumarasamy, Arlington, MA (US);

Gavin R. Kiel, Cambridge, MA (US);

Assignee:

QUADRATIC 3D, INC., Charlestown, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); C08F 2/50 (2006.01); G03F 7/00 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); G03F 7/2041 (2013.01); G03F 7/70208 (2013.01); G03F 7/70575 (2013.01);
Abstract

The present invention relates to photohardenable compositions and methods of forming an object, the method preferably including a photohardenable composition described herein. Preferred photohardenable compositions and methods include a photohardenable resin component, a first photoinitiator that is activatable by exposure to light at a first wavelength and light at a second wavelength, and a second photoinitiator that is activatable by exposure to light at a third wavelength, wherein the first, second, and third wavelengths are not the same, and the third wavelength is shorter than the first wavelength and the second wavelength. Preferred first photoinitators include photoswitchable photoinitiators. Preferably the second light-activated photoinitiator comprises a free-radical photoinitiator. Hardenable resin compositions and methods of forming an object including the hardenable resin composition are also disclosed.


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