The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jun. 26, 2024
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Paul A. David, Bow, NH (US);

Alexander Latham, Harvard, MA (US);

Ronald Lehndorff, Mainz, DE;

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/07 (2006.01); G01R 33/09 (2006.01); H02J 50/00 (2016.01); H02J 50/10 (2016.01);
U.S. Cl.
CPC ...
G01R 33/07 (2013.01); G01R 33/093 (2013.01); G01R 33/096 (2013.01); G01R 33/098 (2013.01); H02J 50/001 (2020.01); H02J 50/10 (2016.02);
Abstract

Systems, structures, circuits, packages and methods provide low-power devices such as sensors and sensor packages having one or more Wiegand coils that can be used for activation of a sensor or other device, as well as potentially supplying operating power. In some embodiments, one or more Wiegand coils can be located in a sensor package, e.g., as one or more discrete components in the package and/or on formed on or connected to a semiconductor die within the package, for providing wake-up and/or continuous power. The Wiegand coil(s) can be separated from the sensor die in some embodiments. In some embodiments, the Wiegand coil(s) can be constructed on the die itself.


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