The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Dec. 03, 2024
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Taketo Chino, Hokuto, JP;

Masayasu Sakuma, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 3/44 (2006.01); G01P 1/02 (2006.01);
U.S. Cl.
CPC ...
G01P 3/44 (2013.01); G01P 1/026 (2013.01);
Abstract

A sensor module includes: a first substrate; a second substrate; a coupling portion that electrically couples the first substrate and the second substrate; a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis; a second sensor device provided on the first substrate, configured to detect the physical quantity of the first axis, and having a drive frequency different from that of the first sensor device; a third sensor device provided on the second substrate and configured to detect a physical quantity of a second axis; and a fourth sensor device provided on the second substrate and configured to detect the physical quantity of the second axis.


Find Patent Forward Citations

Chino, Taketo. (2026). Sensor module and electronic apparatus (U.S. Patent No. 12754199). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12754199

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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