The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Jul. 01, 2023
Applicant:

Purdue Research Foundation, West Lafayette, IN (US);

Inventors:

Fabio Semperlotti, West Lafayette, IN (US);

Mehdi Jokar, Riverside, RI (US);

Siddharth Nair, West Lafayette, IN (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16F 15/02 (2006.01); B32B 3/26 (2006.01); B32B 7/022 (2019.01); B32B 25/04 (2006.01); B32B 27/08 (2006.01); B32B 27/40 (2006.01); F16F 13/06 (2006.01);
U.S. Cl.
CPC ...
F16F 15/022 (2013.01); B32B 3/263 (2013.01); B32B 7/022 (2019.01); B32B 25/04 (2013.01); B32B 27/08 (2013.01); B32B 27/40 (2013.01); F16F 13/06 (2013.01); B32B 2307/10 (2013.01); B32B 2307/536 (2013.01); B32B 2307/54 (2013.01); B32B 2307/72 (2013.01); F16F 2224/025 (2013.01);
Abstract

The vibration attenuation system includes a load bearing layer, a non-load bearing layer, and a rigid beam connector. The load bearing layer has a first density and a first stiffness. The non-load bearing layer has a second density and a second stiffness. The second density is lower than the first density. The rigid beam connector has a third density and a third stiffness. The rigid beam connector couples the load bearing layer to the non-load bearing layer. The coupling of the non-load bearing layer to the load bearing layer is enabled through the use of the rigid beam connector which provides a nonlocal connection to transfer energy from the load bearing layer to the non-load bearing layer.


Find Patent Forward Citations

Quick Actions:

Semperlotti, Fabio. (2026). Vibration attenuation via tailored metastructures (U.S. Patent No. 12753821). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12753821

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